The annual ISTA TransPack forum is a great event showcasing some of the most interesting and technical topics on transport packaging and testing. Held each year, TransPack brings together a global consortium of packaging industry leaders for a ‘spring break’ learning opportunity. TransPack brings together industry professionals to share current best practices and packaging educators & test labs to review their research advancing our understanding of materials and environmental conditions. Schools and agencies participating this year are Michigan State, Clemson, Cal Poly State University, Kasetsart University (Thailand), Virginia Tech, ITENE, BAM Federal Institute for Materials Research and Testing, Korea Agency for Technology and Standards (KATS).
This year, the lineup of presentations appears to be as good as usual. Included in the program is a good mix of topics to optimize packaging design including: paper reducing stretchwrap, edge protection, unitload stability, returnable systems in Northeast Asia, and clamp loading. New this year is a segment dedicated to sustainability; the segment will include a Panel Discussion with participation and updates from Ameripen, Incpen, Fibre Box Association and Sustainable Packaging Coalition (SPC).
As a TransPack first, Stratasys, the leader in 3D printing will be co-presenting with Chainalytics to stress the importance of packaging engineering design input to improve product robustness to best protect against expected environmental hazards.
Please send us a quick email or leave a comment indicating you will also be in Orlando for the ISTA TransPack Forum!